Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10649884
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Filing Dt:
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08/26/2003
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Publication #:
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Pub Dt:
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03/03/2005
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Inventor:
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Chung-Che Tsai
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Title:
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Stacked-chip semiconductor package and fabrication method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2, LI-HSIN ROAD, 3 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| ANDERSON KILL & OLICK, P.C. |
| EUGENE LIEBERSTEIN |
| 1251 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10020 |
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Assignment:
2
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CORRECTED ASSIGNMENT TO CORRECT ASSIGNOR'S NAME, PREVIOUSLY RECORDED ON REEL AND FRAME 014471/0439.
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| NO. 2, LI-HSIN ROAD |
| 3, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| ANDERSON KILL & OLICK, P.C. |
| EUGENE LIEBERSTEIN |
| 1251 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10020 |
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