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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7180149
Issue Dt:
02/20/2007
Application #:
10924205
Filing Dt:
08/24/2004
Publication #:
20050056903
Pub Dt:
03/17/2005
Inventors:
Satoshi Yamamoto, Tatsuo Suemasu, Sayaka Hirafune, Toshihiko Isokawa, Koichi Shiotani et al
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
Assignment: 1
Reel/Frame:
016012/0280Recorded: 11/23/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YAMAMOTO, SATOSHI
Exec Dt:
08/30/2004
SUEMASU, TATSUO
Exec Dt:
08/30/2004
HIRAFUNE, SAYAKA
Exec Dt:
08/30/2004
ISOKAWA, TOSHIHIKO
Exec Dt:
08/30/2004
SHIOTANI, KOICHI
Exec Dt:
08/30/2004
MATSUMOTO, KAZUYA
Exec Dt:
08/30/2004
Assignees:
FUJIKURA LTD.
5-1, KIBA 1-CHOME
KOHTOH-KU, TOKYO, JAPAN
OLYMPUS CORPORATION
43-2, HATAGAYA 2-CHOME
SHIBUYA-KU, TOKYO, JAPAN
Correspondent:
WESTERMAN, HATTORI, DANIELS & ADRIAN, LL
1250 CONNECTICUT AVENUE, NW
SUITE 700
WASHINGTON, DC 20036
Assignment: 2
Reel/Frame:
039344/0502Recorded: 06/27/2016Pages: 156
Conveyance:
CHANGE OF ADDRESS
Assignor:
OLYMPUS CORPORATION
Exec Dt:
04/01/2016
Assignee:
OLYMPUS CORPORATION
2951 ISHIKAWA-MACHI, HACHIOJI-SHI
TOKYO, JAPAN
Correspondent:
CPA GLOBAL LTD
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JE1 1BL JERSEY

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