Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10665309
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Filing Dt:
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09/22/2003
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Publication #:
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Pub Dt:
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03/24/2005
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Inventors:
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Chen-Hua Yu, Tsu Shih, Chung-Shi Liu, Shwang-Min Jeng, Horng-Huei Tseng
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Title:
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Tungsten-copper interconnect and method for fabricating the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 R.O.C. |
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| THOMAS, KAYDEN, HORSTEMEYER ET AL. |
| DANIEL R. MCCLURE |
| 100 GALLERIA PARKWAY, SUITE 1750 |
| ATLANTA, GA 30339-5948 |
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