Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/13/2008
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Application #:
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10680664
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Filing Dt:
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10/07/2003
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Publication #:
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Pub Dt:
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04/07/2005
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Inventors:
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Yian-Liang Kuo, Yu-Chang Lin
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Title:
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INTEGRATED CIRCUIT PACKAGE BOND PAD HAVING PLURALITY OF CONDUCTIVE MEMBERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6 |
| SCIENCE-BASED IDNUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| HAYNES AND BOONE, LLP |
| DAVID M. O'DELL |
| 901 MAIN STREET, SUITE 3100 |
| DALLAS, TX 75202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| HAYNES AND BOONE LLP |
| DAVID M. O'DELL, ESQ. |
| 901 MAIN STREET, SUITE 3100 |
| DALLAS, TX 75202 |
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