Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10635839
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Filing Dt:
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08/06/2003
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Publication #:
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Pub Dt:
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04/14/2005
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Inventors:
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Neil Robert McLellan, Chun Ho Fan, Edward G. Combs, Tsang Kwok Cheung, Chow Lap Keung et al
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Title:
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Integrated circuit package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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QPL INDUSTRIAL BUILDING |
138 TEXACO ROAD |
TSUEN WAN, NT, HONG KONG |
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MILBANK, TWEED, HADLEY & MCCLOY LLP |
CHRISTOPHER J. GASPAR |
ONE CHASE MANHATTAN PLAZA |
NEW YORK, NY 10005 |
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06/22/2024 02:56 PM
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