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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/06/2007
Application #:
10934409
Filing Dt:
09/07/2004
Publication #:
Pub Dt:
04/21/2005
Inventors:
Chi Chih Chu, Cheng-Yin Lee, Gwo-Liang Weng, Shih-Chang Lee
Title:
STACKED PACKAGE MODULE
Assignment: 1
Reel/Frame:
015775/0661Recorded: 09/07/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/07/2004
Exec Dt:
09/06/2004
Exec Dt:
09/06/2004
Exec Dt:
09/06/2004
Assignee:
26 CHIN 3RD RD.
NANTZE EXPORT PROCESSING ZONE
KAOSHIUNG, TAIWAN R.O.C.
Correspondent:
BACON & THOMAS, PLLC
EUGENE MAR
625 SLATERS LANE
FOURTH FLOOR
ALEXANDRIA, VA 22314

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