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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10490659
Filing Dt:
12/30/2004
Publication #:
Pub Dt:
04/28/2005
Inventors:
Keiji Kayaba, Akihiro Tabata, Takafumi Otsu, Yoshiyuki Tsuji, Akio Oura
Title:
Epoxy resin compositions and semiconductor devices
Assignment: 1
Reel/Frame:
015946/0622Recorded: 10/12/2004Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/28/2002
Exec Dt:
01/28/2002
Exec Dt:
01/28/2002
Exec Dt:
09/25/2001
Exec Dt:
01/28/2002
Assignee:
2-1, NIHONBASHI-MUROMACHI 2-CHOME
CHUO-KU, TOKYO 103-8666, JAPAN
Correspondent:
SMITH, GAMBRELL & RUSSELL
1850 M STREET, N.W.
SUITE 800
WASHINGTON, DC 20036
Assignment: 2
Reel/Frame:
015950/0685Recorded: 10/12/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/15/2004
Assignee:
5-8, HIGASHI-SHINAGAWA-2-CHOME
SHINAGAWA-KU, TOKYO, JAPAN
Correspondent:
SMITH, GAMBRELL & RUSSELL
MICHAEL A. MAKUCH
1850 M STREET, N.W.
SUITE 800
WASHINGTON, DC 20036

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