Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10707865
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Filing Dt:
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01/20/2004
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Publication #:
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Pub Dt:
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05/05/2005
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Inventors:
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Da-Jung Chen, Che-Hung Lin, Chin-Hsiung Liao, Cheng-Chieh Hsu
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Title:
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Chip package and substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2, R&D 2ND RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7 FLOOR-1, NO. 100 |
| ROOSEVELT ROAD, SECTION 2 |
| TAIPEI, TAIWAN 100 |
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