Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10949674
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Filing Dt:
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09/24/2004
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Publication #:
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Pub Dt:
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05/05/2005
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Inventors:
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Giles Humpston, David B. Tuckerman, Bruce M. McWilliams, Belgacem Haba et al
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Title:
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Structure and method of making capped chips having vertical interconnects
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3099 ORCHARD DRIVE |
SAN JOSE, CALIFORNIA 95134 |
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LERNER, DAVID, LITTENBERG ET AL |
DARYL K. NEFF |
600 SOUTH AVENUE WEST |
WESTFIELD, NJ 07090 |
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05/12/2024 03:48 AM
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