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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10718897
Filing Dt:
11/20/2003
Publication #:
Pub Dt:
05/12/2005
Inventors:
Shao-Chung Hu, Yu-Ru Yang, Chien-Chung Huang
Title:
Structure and process of metal interconnects
Assignment: 1
Reel/Frame:
014740/0462Recorded: 11/20/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/17/2003
Exec Dt:
11/17/2003
Exec Dt:
11/17/2003
Assignee:
NO. 3-, LI-HSIN RD. II
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN R.O.C.
Correspondent:
J. C. PATENTS, INC.
JIAWEI HUANG
4 VENTURE, SUITE 250
IRVINE, CA 92618

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