Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/18/2008
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Application #:
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10705379
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Filing Dt:
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11/10/2003
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Publication #:
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Pub Dt:
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05/12/2005
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Inventors:
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Jichen Wu, Figo Hsieh
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Title:
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MULTIPLE CHIPS IMAGE SENSOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 84, TAIHO RD. CHUPEI |
| HSINCHU HSIEN, TAIWAN R.O.C. |
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| PRO-TECHTOR INTERNATIONAL |
| KEITH KLINE |
| 20775 NORADA COURT |
| SARATOGA, CA 95070-3018 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 6F., NO. 83, YANPING S. RD., ZHONGZHENG DIST. |
| TAIPEI CITY, TAIWAN 100011 |
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| MCCLURE, QUALEY & RODACK LLP |
| 280 INTERSTATE NORTH CIRCLE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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