Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10717355
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Filing Dt:
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11/19/2003
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Publication #:
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Pub Dt:
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05/19/2005
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Inventor:
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Yuan-Chang Huang
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Title:
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Conductive bumps with insulating sidewalls and method for fabricating
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 51-103, TTSC/B100 195 SECTION 4, CHUNG HSING ROAD |
| CHUTUNG, HSINCHU,, TAIWAN 310 R.O.C. |
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| TUNG & ASSOCIATES |
| RANDY W. TUNG |
| 838 W. LONG LAKE ROAD |
| SUITE 120 |
| BLOOMFIELD HILLS, MICHIGAN 48302 |
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