Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11021411
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Filing Dt:
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12/23/2004
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Publication #:
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Pub Dt:
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05/26/2005
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Inventors:
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Chih-Jung Wang, Tong-Yu Chen
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Title:
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Method for forming openings in low dielectric constant material layer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 3, LI-HSIN RD. II |
SCIENCE BASED, INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. |
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CHARLES CH.H. WU |
98 DISCOVERY |
IRVINE, CALIFORNIA 92618-3105 |
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