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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10979326
Filing Dt:
11/03/2004
Publication #:
Pub Dt:
06/09/2005
Inventors:
Akira Furuya, Nobuyuki Ohtsuka, Shinichi Ogawa, Hiroshi Okamura
Title:
Semiconductor device and its manufacturing method
Assignment: 1
Reel/Frame:
016251/0683Recorded: 02/10/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/15/2004
Exec Dt:
11/10/2004
Exec Dt:
12/08/2004
Exec Dt:
11/24/2004
Assignee:
16-1, ONOGAWA, TSUKUBA-SHI
IBARAKI, 305-8569, JAPAN
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST
1940 DUKE STREET
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
017950/0072Recorded: 07/17/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/16/2005
Assignee:
1753 SHIMONUMABE, NAKAHARA-KU
KAWASAKI, KANAGAWA, JAPAN
Correspondent:
YOUNG & THOMPSON
745 SOUTH 23RD STREET
2ND FLOOR
ARLINGTON, VA 22202

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