Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10500494
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Filing Dt:
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12/27/2004
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Publication #:
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Pub Dt:
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06/09/2005
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Inventors:
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Hyung-Sang Park, Sang-Won Kang
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Title:
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Method of forming copper interconnections for semiconductor integrated circuits on a substrate
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1694-5, SHINIL-DONG, DAEDUK-GU |
DAEJEON, 306-230, KOREA, REPUBLIC OF |
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MARGER JOHNSON & MCCOLLOM, P.C. |
1030 S.W. MORRISON STREET |
PORTLAND, OREGON 97205 |
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