Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10978619
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Filing Dt:
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11/01/2004
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Publication #:
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Pub Dt:
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06/16/2005
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Inventors:
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Ki-hyoun Kwon, Kyung-tae Lee, Seong-ho Liu, Yoon-hae Kim
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Title:
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A bonding pad in a semiconductor device having conductive plug pattern formed on conductive layer.
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MYERS BIGEL SIBLEY & SAJOVEC |
| ROBERT N. CROUSE |
| P.O. BOX 37428 |
| RALEIGH, NC 27627 |
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