Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/25/2006
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Application #:
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10731983
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Filing Dt:
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12/10/2003
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Publication #:
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Pub Dt:
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06/16/2005
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Inventors:
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Tai-Chun Huang, Chih-Hsiang Yao
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Title:
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STRUCTURE AND METHOD FOR REINFORCING A BOND PAD ON A CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 6. LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN R.O.C |
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TUNG & ASSOCIATES |
RANDY W. TUNG |
838 W. LONG LAKE ROAD |
SUITE 120 |
BLOOMFIELD HILLS, MI 48302 |
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