Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10833209
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Filing Dt:
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04/26/2004
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Publication #:
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Pub Dt:
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06/23/2005
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Inventors:
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Yung-Hsiang Wu, Je-Ping Hu, Ming-Huan Yang, Chun-Jung Chen, Chien-Hung Liu
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Title:
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Method for forming wires of sub-micron-order scale
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 195, SEC. 4, CHUNG-HSING RD. |
CHUTUNG CHEN, HSINCHU HSIEN, TAIWAN R.O.C. |
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TOWNSEND AND TOWNSEND AND CREW LLP |
J. GEORG SEKA |
TWO EMBARCADERO CENTER, 8TH FLOOR |
SAN FRANCISCO, CALIFORNIA 94111-3834 |
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