Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10753253
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Filing Dt:
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01/05/2004
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Publication #:
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Pub Dt:
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07/07/2005
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Inventors:
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Hsueh-Chang Wu, Chih-Tien Chang, Jhi-Cherng Lu, Bing-Hung Chen, Mei-Sheng Zhou
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Title:
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Rapid temperature compensation module for semiconductor tool
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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HAYNES AND BOONE, LLP |
DAVID M. O'DELL |
901 MAIN STREET, SUITE 3100 |
DALLAS, TX 75202 |
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