Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/18/2008
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Application #:
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10964972
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Filing Dt:
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10/13/2004
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Publication #:
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Pub Dt:
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07/14/2005
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Inventors:
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Daniel W. Hawtof, Kamjula Pattabhirami Reddy, John Stone III
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Title:
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HERMETICALLY SEALED PACKAGE AND METHOD OF FABRICATION OF A HERMETICALLY SEALED PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PATENT DEPT.; SP-TI-03-1 |
| CORNING, NEW YORK 14831 |
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| KEVIN M ABLE |
| CORNING INCORPORATED |
| PATENT DEPARTMENT |
| SP-TI-03-1 |
| CORNING, NY 14831 |
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