Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10502713
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Filing Dt:
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07/29/2004
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Publication #:
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Pub Dt:
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07/14/2005
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Inventors:
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Gerald Eckstein, Anton Gebert, Joseph Sauer, Jorg Zapf
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Title:
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Chip-size package with an integrated passive component
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| OTTO-HAHN-RING 6 |
| 81739 MUNICH, GERMANY |
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| GEBBERTSTRASSE 125 |
| D-91058 ERLANGEN, GERMANY |
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| STAAS & HALSEY LLP |
| ATTENTION: RICHARD A. GOLLHOFER |
| 1201 NEW YORK AVE., NW, SUITE 700 |
| WASHINGTON, D.C. 20005 |
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