Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09944732
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Filing Dt:
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08/31/2001
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Publication #:
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Pub Dt:
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07/21/2005
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Inventors:
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Lee John Smith, David Albert Zoba
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Title:
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Thin semiconductor package including stacked dies
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85248 |
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| SKJERVEN MORRILL MACPHERSON LLP |
| ROBERT D. WASSON |
| THREE EMBARCADERO CENTER, SUITE 2800 |
| SAN FRANCISCO, CA 94111 |
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