Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11075324
|
Filing Dt:
|
03/07/2005
|
|
Publication #:
|
|
Pub Dt:
|
08/04/2005
| | | | |
|
Inventors:
|
Bruno Ghyselen, Cecile Aulnette, Benedite Osternaud, Takeshi Akatsu et al
|
|
Title:
|
Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| PARC TECHNOLOGIQUE DES FONTAINES |
| 38190 BERNIN, FRANCE 38190 |
|
|
|
|
| ALLAN A. FANUCCI |
| 1700 K STREET N.W. |
| WASHINGTON, DC 20006 |
|
|
Search Results as of:
05/02/2024 11:30 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
