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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	7256075	Issue Dt:	08/14/2007	Application #:	11075273	Filing Dt:	03/07/2005
Publication #:	20050170611	Pub Dt:	08/04/2005
Inventors:	Bruno Ghyselen, Cecile Aulnette, Benedite Osternaud, Takeshi Akatsu et al
Title:	RECYCLING OF A WAFER COMPRISING A MULTI-LAYER STRUCTURE AFTER TAKING-OFF A THIN LAYER

Assignment: 1

Reel/Frame:

015975/0838

Recorded: 05/05/2005

Pages: 10

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

GHYSELEN, BRUNO

Exec Dt:

02/28/2005

AULNETTE, CÉCILE

Exec Dt:

02/28/2005

OSTERNAUD, BÉNÉDITE

Exec Dt:

02/28/2005

AKATSU, TAKESHI

Exec Dt:

02/28/2005

LE VAILLANT, YVES MATHIEU

Exec Dt:

02/28/2005

Assignee:

S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES, S.A.

PARC TECHNOLOGIQUE DES FONTAINES

38190 BERNIN, FRANCE 38190

Correspondent:

ALLAN A. FANUCCI

1700 K STREET N.W.

WASHINGTON, DC 20006

Assignment: 2

Reel/Frame:

018096/0219

Recorded: 08/11/2006

Pages: 8

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE INVENTORS NAME FROM YVES MATHIEU LE VAILLANT TO YVES MATTHIEU LE VAILLANT PREVIOUSLY RECORDED ON REEL 015975 FRAME 0838. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECTED ASSIGNMENT OF ASSIGNORS INTEREST.

Assignors:

GHYSELEN, BRUNO

Exec Dt:

02/28/2005