Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10978451
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Filing Dt:
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11/02/2004
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Publication #:
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Pub Dt:
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09/22/2005
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Inventors:
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Ming-Hsi Tseng, Heng-Chieh Chien, Chih-Yao Wang
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Title:
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Thermal module with heat reservoir and method of applying the same on electronic products
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 195, SEC. 4, CHUNG HSING RD. |
CHUTUNG, |
HSINCHU, TAIWAN |
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TROXELL LAW OFFICE PLLC |
5205 LEESBURGH PIKE |
SUITE 1404 |
FALLS CHURCH, VA 22041-3401 |
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