Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/11/2006
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Application #:
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10813407
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Filing Dt:
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03/29/2004
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Publication #:
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Pub Dt:
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09/29/2005
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Inventors:
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Jiping Li, Peter G. Borden, Edgar B. Genio
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Title:
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HIGH THROUGHPUT MEASUREMENT OF VIA DEFECTS IN INTERCONNECTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| APPLIED MATERIALS, INC. |
| LEGAL AFFAIRS DEPT. - MS 2061 |
| P.O. BOX 450A |
| SANTA CLARA, CA 95052 |
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