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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10816470
Filing Dt:
03/31/2004
Publication #:
20050224980
Pub Dt:
10/13/2005
Inventors:
Jihperng Leu, Chih-I Wu, Mark Y. Liu, Kevin J. Fischer, Chia-Hong Jan, David Gracias
Title:
Interconnect adapted for reduced electron scattering
Assignment: 1
Reel/Frame:
015658/0958Recorded: 08/09/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEU, JIHPERNG
Exec Dt:
07/02/2004
WU, CHIH-I
Exec Dt:
07/19/2004
LIU, MARK Y.
Exec Dt:
07/06/2004
FISCHER, KEVIN J.
Exec Dt:
07/02/2004
JAN, CHIA-HONG
Exec Dt:
07/02/2004
GRACIAS, DAVID
Exec Dt:
06/22/2004
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95052
Correspondent:
SCHWABE, WILLIAMSON & WYATT, P.C.
JAMES J. NAMIKI
1211 SW FIFTH AVENUE
SUITE 1600-1900
PORTLAND, OR 97204

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