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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/12/2007
Application #:
10508460
Filing Dt:
10/18/2004
Publication #:
Pub Dt:
10/13/2005
Inventors:
Shozo Minamitani, Takaharu Mae, Akira Yamada, Shinya Marumo, Yasuharu Ueno et al
Title:
ELECTRONIC COMPONENT MOUNTING METHOD AND APPARATUS AND ULTRASONDIC BONDING HEAD
Assignment: 1
Reel/Frame:
015887/0898Recorded: 10/11/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/17/2004
Exec Dt:
09/22/2004
Exec Dt:
09/17/2004
Exec Dt:
09/22/2004
Exec Dt:
09/22/2004
Exec Dt:
09/22/2004
Exec Dt:
09/24/2004
Exec Dt:
09/22/2004
Exec Dt:
09/21/2004
Exec Dt:
09/21/2004
Exec Dt:
09/17/2004
Assignee:
1006, OAZA KADOMA
KADOMA-SHI, OSAKA 571-8501, JAPAN
Correspondent:
JORDAN AND HAMBURG LLP
C. BRUCE HAMBURG
122 EAST 42ND STREET
SUITE 4000
NEW YORK, NY 10168
Assignment: 2
Reel/Frame:
021930/0876Recorded: 11/20/2008Pages: 24
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/01/2008
Assignee:
1006 OAZA KADOMA, KADOMA-SHI
OSAKA, JAPAN 571-8501
Correspondent:
KENJI KAMATA
1130 CONNECTICUT AVE., N.W., SUITE 1100
PANASONIC PATENT CENTER
WASHINGTON, DC 20036

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