Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11110443
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Filing Dt:
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04/19/2005
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Publication #:
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Pub Dt:
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11/03/2005
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Inventors:
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Heung-Kyu Kwon, Kyung-Lae Jang, Hee-Seok Lee
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Title:
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Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, YEONGTONG-GU, |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MARGER JOHNSON & MCCOLLOM, P.C. |
| 1030 S.W. MORRISON STREET |
| PORTLAND, OR 97205 |
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