Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11127423
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Filing Dt:
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05/11/2005
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Publication #:
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Pub Dt:
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11/17/2005
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Inventors:
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Jinn P. Chu, Chon-Hsin Lin
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Title:
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Copper film containing tungsten nitride for improving thermal stability, electrical conductivity and electric leakage properties and a manufacturing method for the copper film
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 2, PEI-NING ROAD |
KEELUNG, TAIWAN R.O.C. |
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JAMES H. WALTERS |
DELLETT & WALTERS |
P.O. BOX 2786 |
PORTLAND, OR 97208-2786 |
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09/24/2024 03:42 AM
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