Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10850401
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Filing Dt:
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05/20/2004
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Publication #:
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Pub Dt:
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11/24/2005
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Inventors:
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David William Boerstler, Hiroki Kihara, Robert Patrick Putney et al
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Title:
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Thermal protection for a VLSI chip through reduced c4 usage
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-6-21, MINAMI-AOYAMA |
| MINATO-KU, TOKYO, 107-0062, JAPAN |
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| IBM CORPORATION |
| ROBERT M. CARWELL |
| INTELLECTUAL PROPERTY LAW |
| 11400 BURNET ROAD |
| AUSTIN, TX 78758 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION |
| ROBERT M. CARWELL |
| 11400 BURNET ROAD |
| AUSTIN, TX 78758 |
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