Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11174189
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Filing Dt:
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07/01/2005
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Publication #:
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Pub Dt:
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12/01/2005
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Inventors:
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Jing-Cheng Lin, Cheng-Lin Huang, Winston Shue, Mong-Song Liang
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Title:
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Barrier free copper interconnect by multi-layer copper seed
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7839 CHURCHILL WAY |
| M/S 3999 |
| DALLAS, TEXAS 75251 |
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| SWAYZE, JR., W. DANIEL |
| M/S 3999 |
| P.O. BOX 655474 |
| DALLAS, TEXAS 75265 |
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