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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/27/2007
Application #:
11140054
Filing Dt:
05/27/2005
Publication #:
Pub Dt:
12/01/2005
Inventors:
Gwo-Liang Weng, Shih Chang Lee, Wei-Chang Tai
Title:
METHOD FOR BALANCING MOLDING FLOW DURING THE ASSEMBLY OF SEMICONDUCTOR PACKAGES WITH DEFECTIVE CARRYING UNITS
Assignment: 1
Reel/Frame:
016620/0342Recorded: 05/27/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/28/2005
Exec Dt:
03/28/2005
Exec Dt:
03/28/2005
Assignee:
NO. 26, JINGSAN RD.
NANTZ CHIU
KAOHSIUNG, TAIWAN R.O.C., 811
Correspondent:
DANIEL R. MCCLURE
THOMAS, KAYDEN, HORSTEMEYER & RISLEY LLP
100 GALLERIA PARKWAY
SUITE 1750
ATLANTA, GEORGIA 30339

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