Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10859207
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Filing Dt:
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06/03/2004
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Publication #:
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Pub Dt:
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12/08/2005
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Inventors:
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Sinn-Wen Chen, Shih-Kang Lin, Ching-Feng Yang, Ting-Ying Chung, Ying-Mei Tsai, An-Ren Zi et al
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Title:
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Soldering method and solder joints formed therein
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 101, KUANG FU RD., SEC. 2 |
| HSINCHU, TAIWAN 300, R.O.C. |
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| BACON & THOMAS, PLLC |
| EUGENE MAR |
| 625 SLATERS LANE FOURTH FLOOR |
| ALEXANDRIA, VA 22314 |
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