Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11147158
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Filing Dt:
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06/08/2005
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Publication #:
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Pub Dt:
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12/15/2005
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Inventor:
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Taibo Nakazawa
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Title:
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Chip-component-mounted device and semiconductor device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753,SHIMONUMABE |
| NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI |
| KANAGAWA, JAPAN 211-8668 |
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| HOWARD L. BERNSTEIN |
| 2100 PENNSYLVANIA AVE |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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