Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/25/2006
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Application #:
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10883709
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Filing Dt:
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07/06/2004
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Publication #:
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Pub Dt:
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01/12/2006
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Inventors:
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Chin Wen Wang, Pei Choa Wang, Ching Chung Wang
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Title:
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STRUCTURE OF HEAT CONDUCTIVE PLATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1F-9, NO. 40-2, SEC. 1, MINSHENG N. RD. |
| GUEISHAN TOWNSHIP |
| TAOYUAN COUNTY 333, TAIWAN |
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| YI-WEN TSENG |
| 4331 STEVENS BATTLE LN. |
| FAIRFAX, VA 22033 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FLAT/RM 304, DOMINION CENTRE, 43 QUEEN'S RD EAST |
| WANCHAI, HONG KONG |
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| HDLS PATENT & TRADEMARK SERVICE |
| P.O.BOX 220746 |
| CHANTILLY, VA 20153 |
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