Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10964542
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Filing Dt:
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10/13/2004
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Publication #:
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Pub Dt:
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01/12/2006
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Inventors:
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Chien-Chen Lee, Chao-Hui Lin
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Title:
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Multilayer leadframe module with embedded passive component and method of fabricating the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5FL., NO. 5, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU 300, TAIWAN |
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THOMAS, KAYDEN, HORSTEMEYER & RISLEY LLP |
DANIEL R. MCCLURE |
100 GALLERIA PARKWAY, SUITE 1750 |
ATLANTA, GEORGIA 30339-5948 |
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