Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/06/2007
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Application #:
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10716992
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Filing Dt:
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11/19/2003
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Publication #:
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Pub Dt:
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01/12/2006
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Inventors:
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Mark Wesselmann, Kostadin Petkov, Robert Metter, Michael S. Wisnieski, John Boyd
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Title:
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PROTECTING THIN SEMICONDUCTOR WAFERS DURING BACK-GRINDING IN HIGH-VOLUME PRODUCTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 215 SW WASHINGTON STREET, SUITE 204 |
| PORTLAND, OREGON 97204 |
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| IPSG, P.C. |
| DAVID C. ASHBY |
| P.O. BOX 700640 |
| SAN JOSE, CA 95170-0640 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5000 HILLSDALE CIRCLE |
| EL DORADO HILLS, CALIFORNIA 95762 |
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| RIPPEY CORPORATION |
| DAVIE RIPPEY |
| 5000 HILLSDALE CIRCLE |
| EL DORADO HILLS, CA 95762 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE THE NAME AND ADDRESS OF THE SECURED PARTY PREVIOUSLY RECORDED ON REEL 150510 FRAME 0248. ASSIGNOR(S) HEREBY CONFIRMS THE GRANTING OF THE SECURITY AGREEMENT.
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| 13405 FOLSOM BLVD #300 |
| FOLSOM, CALIFORNIA 95630 |
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| KELLY PHAIR MCCARTHY |
| TOMLINSON ZISKO LLP |
| 200 PAGE MILL ROAD 2ND FLOOR |
| PALO ALTO, CA 94306 |
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