Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10976732
|
Filing Dt:
|
10/29/2004
|
|
Publication #:
|
|
Pub Dt:
|
01/19/2006
| | | | |
|
Inventors:
|
Suk-Hyeon Cho, Seok-Kyu Lee, Jong-Kuk Hong, Ho-Sik Jun, Jin-Soo Jeong, Jin-Yong Ahn et al
|
|
Title:
|
Method of fabricating PCB including embedded passive chip
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 314, MAETAN-3DONG, YOUNGTONG-GU, SUWON-SI |
| KYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
|
|
|
|
| GOTTLIEB RACKMAN & REISMAN, P.C. |
| 270 MADISON AVENUE, 8TH FLOOR |
| NEW YORK, NEW YORK 10016-0601 |
|
|
Search Results as of:
09/22/2024 05:24 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
