Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/21/2008
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Application #:
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11180717
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Filing Dt:
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07/14/2005
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Publication #:
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Pub Dt:
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01/19/2006
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Inventors:
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Tomoya Shimonaka, Muneo Miura, Andrew Ong Soon Lee
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Title:
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RESIN ENCAPSULATION MOLDING METHOD FOR SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5, KAMITOBA KAMICHOSHI-CHO, MINAMI-KU |
KYOTO-SHI, KYOTO, JAPAN 601-8105 |
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CHARLES GORENSTEIN |
BIRCH, STEWART, KOLASCH ET AL. |
8110 GATEHOUSE RD, SUITE 100 EAST |
P.O. BOX 747 |
FALLS CHURCH, VA 22040-0747 |
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