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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/30/2007
Application #:
10965093
Filing Dt:
10/13/2004
Publication #:
Pub Dt:
01/26/2006
Inventors:
Chi-Chuan Wu, Ke-Chuan Yang
Title:
FLIP-CHIP SEMICONDUCTOR PACKAGE WITH LEAD FRAME AND METHOD FOR FABRICATING THE SAME
Assignment: 1
Reel/Frame:
015900/0382Recorded: 10/13/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/04/2004
Exec Dt:
10/04/2004
Assignee:
NO. 123, SEC. 3
DA FONG ROAD, TANTZU
TAICHUNG HSIEN, TAIWAN
Correspondent:
EDWARDS & ANGELL, LLP
PETER F. CORLESS
P.O. BOX 55874
BOSTON, MA 02205

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