Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11180494
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Filing Dt:
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07/13/2005
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Publication #:
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Pub Dt:
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02/02/2006
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Inventors:
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An-Hong Liu, Chao Yung Ching, Yao Jung Lee, Yi-Chang Lee, Hsiang-Ming Huang
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Title:
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Chip-under-tape package structure and manufacture thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, YANFA 1ST RD. |
| HSINCHU CITY, TAIWAN 300 |
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| CANON'S COURT |
| 22 VICTORIA STREET |
| HAMILTON, BERMUDA HM12 |
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| HOFFMAN, WARNICK & D'ALESSANDRO LLC |
| 75 STATE STREET, 14TH FLOOR |
| ALBANY, NY 12207 |
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