Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/26/2009
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Application #:
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10900538
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Filing Dt:
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07/28/2004
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Publication #:
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Pub Dt:
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02/02/2006
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Inventors:
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Bruce A. Myers, Darrel E. Peugh, Lester Wilkinson, Erich W. Gerbsch
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Title:
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POWER SEMICONDUCTOR PACKAGE HAVING INTEGRAL FLUID COOLING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LEGAL STAFF - MAIL CODE: 480-410-202 |
| P.O. BOX 5052 |
| TROY, MICHIGAN |
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| DELPHI TECHNOLOGIES, INC. |
| STEFAN V. CHMIELEWSKI |
| LEGAL STAFF - MAIL CODE: 480-410-202 |
| P.O. BOX 5052 |
| TROY, MI 48007-5052 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ERIN COURT, BISHOP'S COURT HILL |
| ST. MICHAEL, BARBADOS |
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| DELPHI TECHNOLOGIES IP LIMITED |
| 5825 INNOVATION DRIVE |
| LEGAL STAFF - M/C 480-415-154 |
| TROY, MI 48098 |
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