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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11153248
Filing Dt:
06/14/2005
Publication #:
Pub Dt:
02/09/2006
Inventors:
Martin B. Barmatz, John D. Mai, Henry W. Jackson, Nasser K. Budraa, W. Thomas Pike
Title:
Microwave bonding of MEMS component
Assignment: 1
Reel/Frame:
017248/0085Recorded: 11/10/2005Pages: 2
Conveyance:
CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/22/2005
Assignee:
300 "E" STREET, SW
WASHINGTON, DISTRICT OF COLUMBIA 20546
Correspondent:
KATHY BAYER
SUITE 9W39-C
OFFICE OF THE GENERAL COUNSEL
300 "E" STREET, SW
WASHINGTON DC 20546
Assignment: 2
Reel/Frame:
017039/0129Recorded: 11/17/2005Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/31/2005
Exec Dt:
10/28/2005
Exec Dt:
11/10/2005
Exec Dt:
10/31/2005
Exec Dt:
11/15/2005
Assignee:
1200 EAST CALIFORNIA BOULEVARD
PASADENA, CALIFORNIA 91125
Correspondent:
SCOTT C. HARRIS
FISH & RICHARDSON P.C.
12390 EL CAMINO REAL
SAN DIEGO, CALIFORNIA 92130

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