Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10913319
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Filing Dt:
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08/09/2004
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Publication #:
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Pub Dt:
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02/09/2006
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Inventors:
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Ming-Sung Tsai, Jin-Ho Kim, Eul-Chul Jang
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Title:
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Stacked chip package with exposed lead-frame bottom surface
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.2, LI-HSIN RD. 3, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, R.O.C., TAIWAN 300 |
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| ROSENBERG, KLEIN & LEE |
| MORTON J. ROSENBERG, ESQ. |
| 3458 ELLICOTT CENTER DRIVE |
| SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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