Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/29/2008
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Application #:
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11201268
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Filing Dt:
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08/10/2005
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Publication #:
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Pub Dt:
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02/16/2006
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Inventors:
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Angelo Merassi, Bruno Murari, Sarah Zerbini
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Title:
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MICRO-ELECTROMECHANICAL STRUCTURE WITH IMPROVED INSENSITIVITY TO THERMOMECHANICAL STRESSES INDUCED BY THE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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VIA C. OLIVETTI, 2 |
AGRATE BRIANZA, ITALY 20041 |
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SEED IP LAW GROUP PLLC |
701 5TH AVENUE |
SUITE 6300 |
SEATTLE, WA 98104 |
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