Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/17/2007
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Application #:
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10919625
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Filing Dt:
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08/17/2004
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Publication #:
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Pub Dt:
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02/23/2006
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Inventors:
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Scott D. Brandenburg, Suresh K. Chengalva, Thomas A. Degenkolb
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Title:
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FLUID COOLED ENCAPSULATED MICROELECTRONIC PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 5053 |
| LEGAL STAFF - MAIL CODE: 480-410-202 |
| TROY, MICHIGAN |
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| DELPHI TECHNOLOGIES, INC. |
| STEFAN V. CHMIELEWSKI |
| P.O. BOX 5052, LEGAL STAFF |
| MAIL CODE: 480-410-202 |
| TROY, MICHIGAN 48007-5052 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ERIN COURT, BISHOP'S COURT HILL |
| ST. MICHAEL, BARBADOS |
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| DELPHI TECHNOLOGIES IP LIMITED |
| 5825 INNOVATION DRIVE |
| LEGAL STAFF - M/C 480-415-154 |
| TROY, MI 48098 |
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