Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10528476
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Filing Dt:
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03/19/2005
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Publication #:
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Pub Dt:
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02/23/2006
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Inventors:
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Naoko Sumi, Hiroki Kamiya, Masanori Okazaki, Yukio Kobayashi, Yoshitaka Samura
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Title:
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Sealing material for semiconductor device and method for production thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12-1, YURAKU-CHO 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8405 |
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| SHINJYUKU MITSUI BLD. 6TH, 1-1 |
| NISHISHINJYUKU 2-CHOME, SHINJYUKU-KU |
| TOKYO 163-0406, JAPAN |
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| ROBERT J. JACOBSON |
| 650 BRIMHALL STREET SOUTH |
| ST. PAUL, MN 55116-1511 |
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