Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11088514
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Filing Dt:
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03/24/2005
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Publication #:
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Pub Dt:
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03/09/2006
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Inventors:
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Michael Feil, Martin Koenig
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Title:
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Method for connecting a chip and a substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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HANSASTRASSE 27C |
MUNICH, GERMANY 80686 |
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LERNER GREENBERG STEMER LLP |
P.O. BOX 2480 |
HOLLYWOOD, FL 33022-2480 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SCHLEISSHEIMER STRASSE 90 |
GARCHING, GERMANY 85748 |
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GEORGE W. RAUCHFUSS, JR. |
OHLANDT, GREELEY, RUGGIERO & PERLE, L.L.P. |
ONE LANDMARK SQUARE, 10TH FLOOR |
STAMFORD, CT 06901 |
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