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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10938439
Filing Dt:
09/09/2004
Publication #:
Pub Dt:
03/09/2006
Inventor:
Vincent K. Chan
Title:
Method and apparatus for a stacked die configuration
Assignment: 1
Reel/Frame:
015784/0931Recorded: 09/09/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/08/2004
Assignee:
1 COMMERCE VALLEY DRIVE EAST
MARKHAM, ONTARIO, CANADA
Correspondent:
VEDDER, PRICE, KAUFMAN & KAMMHOLZ, P.C.
CHRISTOPHER J. RECKAMP
222 N. LASALLE STREET
CHICAGO, IL 60601
Assignment: 2
Reel/Frame:
025573/0443Recorded: 12/30/2010Pages: 5
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/25/2006
Assignee:
1 COMMERCE VALLEY DRIVE EAST
MARKHAM, ONTARIO, CANADA L3T 7X6
Correspondent:
CHRISTOPHER J. RECKAMP
222 N. LASALLE STREET
VEDDER PRICE P.C.
CHICAGO, IL 60601

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